Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

What Does the Future of Wireless Charging Technology Look Like?

 

By: Hrishikesh Kadam, Research Content Developer at Global Market Insights (GMI) The world is rapidly going wireless. Within a span of a few decades, phones and internet became wireless, and now charging has become wireless. Even though wireless charging is still pretty much in its early stages, the technology is anticipated to evolve dramatically over the next few … [Read more...]

Current Trends in Flexible Graphite for Cooling Advanced Consumer Electronics

 

Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being thin or lightweight are desired. There are two types of flexible graphite, natural and … [Read more...]

Tough Epoxy Polysulfide Adhesive Resists High Temperatures

 

Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]

Power-Rail Dissipation: Diverse Appearances, Unforeseen Consequences

 

One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger cable. As currents increase to tens of amps and much higher, the IR-drop problem become more acute. Even a modest 50 mΩ of … [Read more...]

Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis

 

Innovative multi-physics technology furthers Cadence’s expansion into fast-growing system analysis and design market SAN JOSE, Calif., September 17, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence® Celsius™ Thermal Solver, the industry’s first complete … [Read more...]

Industry Sponsors

Sponsor
Sponsor