Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how certain surfaces affect the transport of heat at the phonon level could have implications in everything from thermoelectric materials to … [Read more...]
Heat Exchangers Cool Electrical and Electronic Enclosures
EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom equipment, computers, security equipment and other electronics and electrical devices housed in … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization
Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in which test measurements and analysis were conducted in steady-state conditions to characterize the thermal … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks
Bruce Guenin Associate Technical Editor, Electronics Cooling INTRODUCTION The previous column, "Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)" dealt with the application of JEDEC thermal metrics to IC packages that do not have heat sinks attached to them [1]. The methods are applicable to prediction of the junction … [Read more...]
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