Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
Cooling Fans and Accessories Protect Critical Components
NTE Electronics has released a new line of cooling fans and accessories to protect critical electronic components from premature failure due to heat. Available in five different sizes—40x40mm, 60x60mm, 80x80mm, 92x92mm and 120x120mm—the new AC and DC fans from NTE Electronics utilize a propeller to create a large airflow in the direction of the axis, moving the air in a … [Read more...]
Fansinks for High Temperature Applications
CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Mini Thermoelectric Modules Incorporate Thermally Conductive Circuit Boards
Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards, the new TIam OptoTEC series improves the … [Read more...]
Heating Up Nanodevices May Keep Electronics Cool
As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with new methods to adequately manage the increasing amount of heat being generated by shrinking next-generation devices. Now, scientists at University of … [Read more...]
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