Fan and blower manufacturer ebm-papst has released FlowGrid, a patent-pending air-inlet grill designed to reduce noise levels for fans installed within limited-space air-moving equipment. “FlowGrid is the result of our extensive airflow testing for inlet conditions with a wide variety of customers’ axial and centrifugal fans across dozens of applications,” George Riker, … [Read more...]
Thermal Management of Many-Core Processors Using Power Multiplexing
Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
New Fan Delivers High Static Pressure and Energy Reduction
Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and energy reduction, the company says, offering cooling performance equivalent to that of three conventional products in series. The San Ace 92 9HV type is ideal for use in servers, data storage systems, … [Read more...]
Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments
CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat sink to cool more than 300w in the latest Intel and AMD processors without hot spots at 65°C case temperature in 25°C ambient. Comparable in size to … [Read more...]
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