Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
Stamped CPU Heat Sink Cools High Power Components
Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik. According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
Multi-Purpose Cold Plates for TEC, LED and Semiconductor Cooling
Custom liquid cooling solutions provider Koolance has released three new multi-purpose cold plates for heat sources ranging from 25-50 mm/sq. The three models— PLT-UN50F, PLT-UN40F and PLT-UN25F—are ideal for thermal applications such as thermoelectric cooling, LEDs, image sensors and semiconductor cooling. PLT-UN50F features a cooling area footprint of 50mm x 50mm (1.97in x … [Read more...]
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