Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate indefinitely, in a given thermal environment, without exceeding the temperature limits of the device. The TDP for a consumer electronics … [Read more...]
Summary of the IEEE ITherm 2022 Conference
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2022 was sponsored by … [Read more...]
Calculating Interface Resistance
Introduction The exposed surface area of many of today’s high-powered electronic packages is no longer sufficient for the removal of the heat generated during normal operation. Heat sinks are a commonly-used, low cost means of increasing the effective surface area for dissipating heat by means of convective air cooling. While the use of a heat sink lowers the fluid-side … [Read more...]
Statistics Corner: Probability
Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine with additional measurements. Statistical analysis uses the mathematics of probability to create tools that we can use to deal with … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
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