In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selection and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
TEAs from Laird Deliver Compact Cooling Performance for Analytical and Medical Instrumentation
When used with an SR-54 Series programmable temperature controller, the Tunnel Series thermoelectric assemblies (TEAs) provides precise temperature control with condensation protection for applications below dew point. April 30, 2018 -- Global technology leader Laird (LRD: London) has expanded its thermoelectric assembly (TEA) product offering to better support heating and … [Read more...]
Increasing Adoption of Cryocoolers in the Semiconductor Industry driving the growth of Cryocoolers Market
The report "Cryocooler Market by Type (GM, PT, JT, Stirling, and Brayton Cryocoolers), Services (Technical Support, Repair, Preventive Maintenance), Heat Exchanger Type (Recuperative and Regenerative), Application, and Geography - Global Forecast to 2022". The global cryocooler market is projected to reach USD 2.99 Billion by 2022, at a CAGR of 7.00% between 2017 and 2022. … [Read more...]
Thermal Management of Outdoor Enclosures, Part 1
The pace of development in the electronics and telecommunication fields has been accelerating in all aspects of the business. For example, electronics/telecommunications equipment has traditionally been housed in large buildings, smaller buildings (sheds) and outdoor cabinets. The introduction of the electronics to the outside has imposed serious constraints on enclosure design … [Read more...]
The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-dimensional, Conjugate Heat Transfer World
INTRODUCTION As integrated circuits were becoming more widespread in the 1980’s, most of the developmental problems had to do the with electrical operation of the devices and not so much on cooling them, due to low power levels. It was the electrical engineers who did the functional testing, an activity that ultimately expanded to include thermal testing. Even the thermal … [Read more...]
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