Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s Information-Communications-Technologies (ICT) infrastructure, a general representation of cloud-based computing, is estimated to … [Read more...]
Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution
Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined by research published in RSC Advances, are three-dimensional porous structures consisting of metallic clusters and organic linkers adept … [Read more...]
Superconducting Refrigerator Cools via Tunneling Cascade
Researchers from Italy and France have proposed a new design for a superconducting refrigerator that uses a series of steps to more effectively cool objects down to temperatures near absolute zero. Conventional superconducting refrigerators rely a array of superconductors (S), normal metals (N) and tunnel barriers (I) that are arranged in a symmetric configuration (SINIS or … [Read more...]
New Magnetocaloric Material Could Lead to Greener Refrigerators
The recent discovery of a new magnetocaloric material with intriguing characteristics could lead to a greener method of cooling, potentially providing a more environmentally-friendly alternative to standard refrigeration. A joint team of researchers from Canada and Bulgaria have developed a new method of green cooling by identifying a multiferroic compound, HoMn2O5, that could … [Read more...]
Adhesive Cures at Temperatures as Low as 60°C
DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging and other applications where … [Read more...]
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