Researchers at the University of Houston have discovered a new thermoelectric material capable of high performance at temperatures ranging from room temperature to 300 degrees Celsius (573 degrees Fahrenheit) and possibly higher. The material is reportedly the first new high-efficiency thermoelectric material in 60 years, and could be important for both clean energy research … [Read more...]
High Power Thermoelectric Cold Plate for 19-Inch Racks
Elite Thermal Engineering, a developer of high power, high performance thermoelectric cooling devices, has released a 19-inch version of its thermoelectric cooling plate OCP-300 and high power heat sink HS-004 created for use with 19-inch rack systems in both OEM and laboratory applications. The new model numbers are OCP-300L and HS-004L, respectively. Measuring 15 in. long x … [Read more...]
New Research Shows Unlimited Heat Conduction Potential in Graphene
An international team of scientists has found the thermal conductivity of graphene changes depending on the size of the material sample, a discovery they say challenges the fundamental laws of heat conduction for extended materials. Davide Donadio, head of a research group at the Max Planck Institute for Polymer Research (MPI-P) in Germany and his colleagues from the National … [Read more...]
Power Cycle and Thermal Testing of Electronic Components
Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal for reliability testing of power electronic components used in industries such as automotive and transportation including in hybrid … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
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