AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of thermal expansion (CTE) deficiencies. Naturally tacky with no adhesive, fiberglass or other non-conductive … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing
Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest. This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for supercomputers, HPC clusters and other high density electronics. We explain the inner workings of the first commercial open … [Read more...]
Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization
Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in which test measurements and analysis were conducted in steady-state conditions to characterize the thermal … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks
Bruce Guenin Associate Technical Editor, Electronics Cooling INTRODUCTION The previous column, "Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)" dealt with the application of JEDEC thermal metrics to IC packages that do not have heat sinks attached to them [1]. The methods are applicable to prediction of the junction … [Read more...]
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