Thermal management product designer US Tech has released three new high performance fan series for use in 1U rack applications. The 36mm model produces 24.16 CFM of air volume and 67.52 mm-H2O pressure. In addition, its adherence to the 1U spec of 1.75” (44.45mm) outside to outside tall will leave enough height to design a FRU (Field Replaceable Unit) if desired. The 38mm and … [Read more...]
Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications
EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and electrical devices, the Protector series pre-packaged enclosures combine several of EIC's standard cabinet sizes with … [Read more...]
Prehistoric Cave Paint to Shield Solar Spacecraft
A European spacecraft scheduled for launch towards the sun in 2017 will be shielded from extreme temperatures by a type of paint once used in prehistoric cave art. Carrying instruments to perform high-resolution imaging of the sun, the European Space Agency’s Solar Orbiter will travel as close as 42 million kilometers, or a little more than a quarter of the distance to Earth, … [Read more...]
Apple Files Patent for Smaller, Quieter Wireless Cooling Fan
A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain components limit how thin and light the company can make their devices. One such component is the cooling fan, an essential thermal management … [Read more...]
Heat Sink Series Provides Modular Cooling Options for Electrical Components
Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
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