NTE Electronics has released a new line of cooling fans and accessories to protect critical electronic components from premature failure due to heat. Available in five different sizes—40x40mm, 60x60mm, 80x80mm, 92x92mm and 120x120mm—the new AC and DC fans from NTE Electronics utilize a propeller to create a large airflow in the direction of the axis, moving the air in a … [Read more...]
Fansinks for High Temperature Applications
CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Mini Thermoelectric Modules Incorporate Thermally Conductive Circuit Boards
Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards, the new TIam OptoTEC series improves the … [Read more...]
Research Could Lead to New Thermal Flow Control Devices
Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at Purdue University, the technology utilizes tiny triangular or T-shaped structures made of graphene nanoribbons to control phonons, quantum … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
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