The application of an electric field to a condenser could double the efficiency of surface heat transfer in power plant and high performance computing cooling systems, according to new research released by scientists at MIT. The discovery—made by MIT postdoc Nenad Miljkovic, associate professor of mechanical engineering Evelyn Wang, graduate student Daniel Preston, and former … [Read more...]
Cooling the Cloud: Energy-Efficient Warm-Water Cooling of Servers
Milnes P. David, Robert Simons, David Graybill, Vinod Kamath, Bejoy Kochuparambil, Robert Rainey and Roger Schmidt ; IBM Systems & Technology Group, Poughkeepsie, New York and Raleigh, North Carolina Pritish Parida, Mark Schultz, Michael Gaynes and Timothy Chainer; IBM T.J. Watson Research Center, Yorktown Heights, New York INTRODUCTION Data centers now consume a … [Read more...]
Characterization of Server Thermal Mass
Mahmoud Ibrahim Panduit Corporation The continuous growth of internet business and social media is necessitating the construction of new data centers to support the rising volume of internet traffic. This is in addition to the increasing number of colocation facilities being built to support different business sizes with different functions. Generally, data centers are … [Read more...]
Thermal Management of Many-Core Processors Using Power Multiplexing
Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
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