Data center airflow management solutions provider Upsite Technologies is now offering EnergyLok Cooling Capacity Assessment, a new service designed to help data center operators assess their cooling infrastructure and identify savings opportunities that could be realized through applying new airflow management practices. According to the company, the vendor-neutral service … [Read more...]
'On-Demand' Nano-sized Heat Sinks Lower IC Temperatures
Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a professor at the School of Electrical and Computer Engineering, and his colleagues demonstrate the “on-demand” creation of tiny nanofin heat … [Read more...]
Stamped CPU Heat Sink Cools High Power Components
Electronic components manufacturer ASSMANN WSW has released a new series of stamped CPU heat sinks for cooling pin grid arrays, ball grid arrays or other high power components. The series is available from distributor Rutronik. According to the company, the new CPU heat sinks offers an improve air convection of up to five percent because of non-simultaneous heating from one … [Read more...]
New PMIC Reduces Thermal Stress in Processors
High performance analog IC and sensor provider ams AG has introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit designed to help reduce the thermal stress of applications processors in smartphones and tablets. When paired with ams’ new AS3729 point-of-load regulators, AS3721 provides a complete power management system that offers a fast … [Read more...]
Material Solutions for High-Frequency, High-Thermal-Reliability and Multilayer Circuits
Rogers Corporation, a manufacturer of specialty materials and components that enable high performance and reliability of consumer electronics, power electronics and telecommunications infrastructure, will be featuring its new high-Dk RO4360G2 laminate and 2929 bondply materials at the PCB West 2013 conference and exhibition Sept. 25, 2013 in Santa Clara, Calif. According to … [Read more...]
- « Previous Page
- 1
- …
- 122
- 123
- 124
- 125
- 126
- …
- 214
- Next Page »
