New technology from researchers at the University of Houston has the potential to increase vehicle mileage by five percent and power plant and industrial processing performance by as much as 10 percent. The breakthrough combines tin telluride and chemical element indium in a material that can capture waste heat and convert it into electricity. According to Zhifeng Ren, M.D. … [Read more...]
Asetek and STG Partner to Expand Service for Data Center Liquid Cooling Systems
Liquid cooling systems provider Asetek has entered into an agreement with Signature Technology Group (STG), one of the largest data center service providers in the industry, to provide a warranty, service and support program for Asetek liquid cooling-equipped data centers. The agreement will help Asetek not only expand sales of new servers, but also support servers already … [Read more...]
New Cooling Technology Offers Helium Alternative
A new way to cool magnets to the extremely low temperatures needed for MRI machines may hold the answer to overcoming the effects of the increasing global helium shortage. Well-known for its use in party balloons, helium is also used in the cooling of superconducting magnets, with the main commercial application being in MRI (magnetic resonant imaging) scanners and particle … [Read more...]
New Thermoelectric Peltier Cooler
Temperature control specialist Oven Industries Inc. has released a new line of thermoelectric peltier coolers for use in a variety of temperature control applications. Ideal for usage in universities, science laboratories, PCR research and businesses that specialize in temperature control, the 5R6-900 peltier cooler features an easy-to-read digital display for controlling … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
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