A breakthrough demonstration of heat dissipation at the atomic scale by an international research team could help scientists overcome major technological hurdles in the development of smaller, more powerful electronics. Heat—produced when a current passes through a conductive material—remains a major obstacle in the continuing development of smaller, faster, more reliable … [Read more...]
Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
Server manufacturers and data center managers are showing a greater concern regarding the energy efficiency and cooling of the new generation of servers for data centers. With very large data centers exceeding 100 000 servers, some even consuming more than 50 MW [1] to operate, this electrical energy is directly converted to heat and then simply “wasted” as it is dissipated … [Read more...]
Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there is a similar analogy for thermal engineers that regardless of when we get paid, thermal energy will flow in the direction of decreasing temperature. The direction of heat flow with respect to temperature … [Read more...]
Electronic Performance Impact of Elevated Humidity Environments – Implications for Free Air Cooling of Data Centers
Introduction The computer industry is exploring various options for reducing the cost and energy consumption associated with cooling data centers. The use of liquid cooling in the data center has long been exploited as a more energy efficient means of heat removal than forced air cooling. However, more recently, there has been considerable interest in cooling data centers by … [Read more...]
“Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
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