Introduction The computer industry is exploring various options for reducing the cost and energy consumption associated with cooling data centers. The use of liquid cooling in the data center has long been exploited as a more energy efficient means of heat removal than forced air cooling. However, more recently, there has been considerable interest in cooling data centers by … [Read more...]
“Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
Data Center Liquid Cooling Process Wins Energy Efficiency Award
The Uptime Institute has recognized 3M Company, Iceotope Research and Development Ltd. and the University of Leeds in the UK as joint-Green Enterprise IT (GEIT) award winners for their development of new data center liquid cooling methodologies designed to improve energy efficiency in data servers. Based in New Mexico, the Uptime Institute offers education, consulting, … [Read more...]
PMIC Helps Reduce Thermal Stress of Smartphone and Tablet Processors
Patented design enables board designers to place the new AS3721 PMIC and applications processor further apart to reduce hotspot intensity. Ams AG, a provider of high performance analog ICs and sensors, has introduced the AS3721, a power management IC with a remote-feedback circuit that helps manage the thermal stress of applications processors in space-constrained … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
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