Thermoelectric air conditioner manufacturer EIC Solutions, Inc. has released the ThermoTEC 145 series 1500 BTU military-grade air conditioner for use in transit cases for mobile military and defense applications. According to Jamie Alletag, EIC Solutions sales engineer, the rugged 145 series military-grade cooler’s auto ranging feature makes the units completely functional in … [Read more...]
Vibration-Free Cooling Technology to Replace Mechanical Compressors in Sensitive Space Applications
Researchers at the University of Twente in the Netherlands have developed a new technology for cooling optical detectors on spacecraft that could help the sensors better detect weak “space signals” that originate from far-away, extremely cold sources. The new development is part of a project commissioned by the European Space Agency. Current cooling systems use mechanical … [Read more...]
Three-Dimensional Chip-Cooling Technology Could Multiply Heat Removal Tenfold
Researchers from the Georgia Institute of Technology in Atlanta, Ga. have been awarded a $2.9 million Defense Advanced Research Projects Agency (DARPA) contract to develop three-dimensional chip-cooling technology capable of dissipating up to 10 times the amount of heat currently removed by cooling systems used today. The new technology will also need to successfully manage … [Read more...]
New Super-Cooling Technique Brings Quantum Computing Closer to Reality
Scientists at the University of California Los Angeles have developed a new technique for super-cooling molecules by combining two traditional atomic cooling technologies that may prove to be a breakthrough for quantum computing. According to Eric Hudson, a UCLA assistant professor of physics, scientists have only succeeded in creating a few specific kinds of the ultra-cold … [Read more...]
Heat Sink with Embedded Fan Suitable for Low-Profile Applications
Thermal solutions developer JARO Thermal has released the new “skive” cooler comprised of a 50x50x13 mm fan embedded inside a skived-copper-fin heat sink for low-profile applications including network interface cards, video graphic cards, PCI express and IC spot cooling. According to the company, “the dense arrangement of thin copper fins offers unheralded thermal … [Read more...]
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