Apple has released a new software update designed to combat the emerging problem that many consumers are facing with the cooling fans inside early 2013 Retina MacBook Pro laptops. According to a growing number of users posting on the official Apple support forums and reports from other websites, the fan inside the particular MacBook Pro model increases its speed to a potential … [Read more...]
Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
STULZ Air Technology Systems, Inc., a provider of cooling solutions and services for mission critical applications, has released the STULZ CyberCon modular outdoor cooling system designed for fast deployment with containerized computer rooms (PODs). According to the company, the new cooling system’s modular design “reduces up-front capital costs and adapts to rapidly changing … [Read more...]
Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
Data center developer Minkels has released its Next Generation Cold Corridor, “a modular and highly flexible aisle containment solution that separates hot and cold airflows in an energy-efficient manner.” The new data center cooling solution was presented London’s Data Centre World 2013 conference in late-February. According to Jeroen Hol, chief executive officer at Minkels, … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
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