Dr. John Summers demonstrates the Icetope liquid cooling system by submerging an iPhone in the 3M Novec solution. (Video: University of Leeds) Researchers at the University of Leeds in the United Kingdom have developed a cooling method that they claim reduces energy consumption for cooling by 80 to 97 percent by immersing server components in an electrically non-conductive … [Read more...]
Microsoft to Expand Hybrid Indoor-Outdoor “Roofless” Data Center
Microsoft has announced that the company’s newest data center campus will be expanded to include two more data center facilities. Located in Boydton, Va., the facility houses server racks both indoors and outdoors within larger enclosures as part of a hybrid design engineered to reduce operating costs and increase energy efficiency. The new expansion will bring the data … [Read more...]
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird currently have a strategic design and distribution partnership, the acquisition will … [Read more...]
New Magnetic Cooling Technology Decreases Environmental Impact of Cooling, Avoids Side Effects of Magnetic Fields on Electronics
Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and … [Read more...]
DARPA Releases Request for Industry Assistance in Developing New Cooling Techniques
The U.S. Defense Advanced Research Projects Agency (DARPA) has released a formal request to industry for assistance in the development of new electronics cooling techniques for use in military embedded systems and radio frequency monolithic microwave integrated circuit (MMIC) power amplifiers. The request comes as part of the Intrachip/Interchip Enhanced Cooling (ICECool) … [Read more...]
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