Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
Thermoelectric Air Conditioners with Heat Exchanger Mode
TECA Corp. has introduced two thermoelectric air conditioner models with a heat exchanger mode. They are designed to cool high-heat electronics such as military embedded systems. The heat exchanger mode switches on as the enclosure temperature rises through 25C. and uses 83% less energy than in the active cooling mode. Active cooling and heating is achieved with the use of … [Read more...]
Simplified Data Center Rack Cooling Management
The C degree Flow™ strip from Telect simplifies the managing of data center rack temperatures and increases cooling efficiencies. Using the strip's inherent and bold color-shifting properties, a technician can easily assess data center temperatures and be assured that all is cool. Additionally, temperatures across a rack can be increased by knowing where the cold air is going, … [Read more...]
Space Exploration and Higher Education Will Both Benefit From New NASA Partnership
NASA Goddard has entered into a collaboration designed to enhance the science, technology, engineering and math capabilities within two Historically Black College and University institutions over the course of a three-year program. Professors and students from Alabama A&M University and Tuskegee University will be building a library of electronic designs for future … [Read more...]
Hot-Water Cooled Supercomputer
The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than air-cooled systems using a new form of IBM’s hot-water cooling technology. It cools active components in the system such as processors and memory modules … [Read more...]
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