Mentor Graphics Corporation announced the Flowmaster(R) Power and Energy version for system level thermo-fluid simulation. This new product provides a two-phase solution modeling the phase change from liquid to vapor for steam generation or from vapor to liquid when steam is consumed. The software introduces a complete steam/water Rankine Cycle simulation capability for the … [Read more...]
Research Program Attempts Embedded Cooling
DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and packages. … [Read more...]
U.S. Navy Incorporates New Test Equipment Products
National Instruments announced that Lockheed Martin will integrate NI PXI modular instrumentation and platform products into the U.S. Navy’s electronic Consolidated Automated Support System (eCASS) automated test equipment family. The eCASS test stations replace the existing CASS program as the U.S. Navy’s core test system for on-ship and onshore electronic subassembly … [Read more...]
New Panel Coolers Decrease Noise Level
Nex Flow™ Air Products introduces a simple and inexpensive solution to heat related problems in Industrial Control Enclosures while addressing the increasing concern about noise levels in the work environment. Silent X-Stream ™ Frigid –X™ Panel Coolers are now available with electronic control to conserve compressed air and set the desired temperature in the control … [Read more...]
Thin-film TEC Improves Cooling Performance
Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower input power requirements, and greater opportunities for solving thermal issues in electronics, photonics and avionic … [Read more...]
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