A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit in less time than it takes to blink. Led by aerospace engineering professor Scott White and materials science and engineering professor Nancy Sottos, the researchers published their results in the journal Advanced Materials. As electronic … [Read more...]
Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates
The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air to carry the heat away from the chip, and reject it to the ambient. Air cooled heat sinks are the most commonly used air-cooling devices with … [Read more...]
Thermal Modeling and Testing for LEDs and Luminaires
Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can model and improve heat transfer through the LED, printed circuit board (PCB) or luminaire system during design and … [Read more...]
Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1
Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]
Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction
Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which strongly influence the performance, reliability and efficiency. A significant modeling issue is to obtain a compact but … [Read more...]
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