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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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30 GHz Leadless Chip Carrier Packaging Platform

 

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]

Cold Plates for Demanding Military Cooling Applications

 

Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers can reduce system size, weight, and power with improved cooling, permitting better mobility and extended mission … [Read more...]

Breakthrough Thermal Material System to Enable Faster Computing

 

Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]

Ceramic Pump Components for Hybrid Cars

 

Morgan Technical Ceramics is providing ceramic components for three water cooling pumps that will be used in hybrid and electric vehicles to cool the high energy battery, the cabin heater and the power electronics loop that drives the vehicle. Ceramic gives high quality performance in harsh environments where aggressive glycol coolants are used. This makes it ideal for the … [Read more...]

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