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Electronics Cooling

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New White Paper Data Center Cooling Challenges at the Device

 

Hardcore Computer, Inc. has released "Liquid Blade™ – A Revolution in Data Center Design.” Liquid Blade was named “Best Datacenter Innovation” at the 2010 Blade Insights Summit. An independent study revealed that Liquid Blade can deliver up to an 80% reduction in data center cooling costs and reduces construction and on-going operating costs by up to 25%. Download the white … [Read more...]

30 GHz Leadless Chip Carrier Packaging Platform

 

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]

Cold Plates for Demanding Military Cooling Applications

 

Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers can reduce system size, weight, and power with improved cooling, permitting better mobility and extended mission … [Read more...]

Breakthrough Thermal Material System to Enable Faster Computing

 

Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat … [Read more...]

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