High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
Thermal Design Challenges in Automotive Alternator Power Electronics
Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960's, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts a typical cutaway section of a modern day alternator. At first glance one may think that cooling the diodes in a rectifier bridge of an … [Read more...]
Temperature and reliability in electronics systems – the missing link
To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the technology unless the telecommunication system is as dependable as a car. Just as turning the ignition key should produce the right engine … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
The Challenge of Operating Computers at Ultra-low Temperatures
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance. But as minimum feature size passed well into the sub-micron and now into the nanometer region, this route to higher performance has … [Read more...]
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