High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
Electronic Information Exchange
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF) is the most used file format for exchanging printed circuit assembly (PCA) data between electrical and mechanical CAD/CAE systems and for … [Read more...]
Thermal Design Challenges in Automotive Alternator Power Electronics
Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960's, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts a typical cutaway section of a modern day alternator. At first glance one may think that cooling the diodes in a rectifier bridge of an … [Read more...]
Temperature and reliability in electronics systems – the missing link
To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the technology unless the telecommunication system is as dependable as a car. Just as turning the ignition key should produce the right engine … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
- « Previous Page
- 1
- …
- 208
- 209
- 210
- 211
- 212
- …
- 216
- Next Page »
