Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These advances began with the introduction of the transistor in 1947 and continue today with ultra-large scale integration at the chip level … [Read more...]
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT. To summarize the uses of these metrics: JA represents the junction-to-air thermal resistance for a package tested in an industry-standard test environment. It is … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
Computer-related thermal packaging at the millenial divide
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as a key enabling technology in the development of advanced microelectronic systems and has facilitated many of the "Moore's Law" [Moore, G.E., 1975] … [Read more...]
Adjusting temperatures for high altitude
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and qualify such products. There are a variety of corrections used to account for this effect, many of which sacrifice accuracy for simplicity. … [Read more...]
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