Figure 1. Thermal analog model of an OSP enclosure Introduction Over the past twenty years, telecommunications electronics have become increasingly decentralized - moving ever furtherfrom the controlled and protected environment of the Central Office intothe Outside Plant (OSP). The OSP environment contains rain and humidity,dust and pollutants, significant daily and annual … [Read more...]
Forced convection cooling of airborne electronics
Figure 1. AFT description Fin pitch = 25.01 per in = 985 per mPlate spacing, b = 0.200 in = 5.08 x 10-3 m Fin Length = 0.111 in = 2.8 x 10-3 m Flow passage hydraulic diameter 4rh = 0.004905 ft = 1.50 x 10-3 m Fin metal thickness = 0.004 in = 0.102 x 10-3 m Total heat transfer area/volume between plates, ß = 719.4 ft2 / ft3 = 2,360 m2 / m3 Fin area / total area = … [Read more...]
An introduction to thermoelectric coolers
Figure 1: Cross Section of a Typical TECouple Introduction Thermoelectric coolers are solid state heat pumps used in applications wheretemperature stabilization, temperature cycling, or cooling below ambient arerequired. There are many products using thermoelectric coolers, including CCDcameras (charge coupled device), laser diodes, microprocessors, blood analyzersand portable … [Read more...]
Thermal control of space electronics
Introduction Telecommunication satellites are all based on the same overall design usinga 3 axis stabilization process, in which the North and South panels act asradiators and so ensure heat removal. This basic principle is illustrated in Figure 1. The ever-increasing demandfor national and international space-based communications in parallel with theevolution of space … [Read more...]
Direct liquid immersion cooling for high power density microelectronics
Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears, significant advances have been made in the application of air coolingtechniques to manage increased heat fluxes. Although air cooling … [Read more...]
