Phononic has recently announced that the HEX 2.0, its high performance small form factor CPU cooler for gaming and high performance PCs, is now available. The HEX 2.0 is a compact, but powerful CPU cooler designed to fit in small chassis, including mini-ITX cases, while delivering cooling capacity that outperforms similarly-sized 92mm coolers and many larger air or water CPU … [Read more...]
Thermoregulation Comfort Clothing Advance to Product Platforms
Electronics Cooling’s previous coverage of thermoregulation fabrics is further augmented by a very encouraging trend seen at the recent Wearables USA Conference held last week in Silicon Valley, CA. More than half a dozen companies showcased product design platforms that enable OEMs (original equipment manufacturers), ODMs (original device manufacturers), and makers alike to … [Read more...]
University of Toronto Selects CoolIT Systems to Liquid Cool Signal Processor for CHIME Project
Calgary, AB. November 10, 2016 – CoolIT Systems, the world leader in energy efficient liquid cooling solutions for the HPC, Cloud and Enterprise markets, has been selected by the University of Toronto to provide custom liquid cooling for its new signal processing backend which will support Canada’s largest radio telescope, the Canadian Hydrogen Intensity Mapping Experiment … [Read more...]
Cooling Technology Enables Fashion-Tech Wearable Products
In one of our previous blogs on Electronics Cooling of Humans, we highlighted some of the on-going research projects at various universities in the US sponsored by ARPA-E. These projects are expected to achieve a step-change in the cooling technology of wearable fabrics and the costs of manufacturing them. It is worth noting that prior to the effort sponsored by ARPA-E, thermal … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
- « Previous Page
- 1
- …
- 66
- 67
- 68
- 69
- 70
- …
- 214
- Next Page »
