by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements
Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the implications of subjecting thermal requirements on suppliers or coworkers. A rush to get a quick answer or to use the latest feature in an analysis software code … [Read more...]
Application of Phase Change Materials in Handheld Computing Devices
William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are excellent candidates for use of phase change materials (PCMs). Processor loads in handheld products are highly variable. There … [Read more...]
The Hidden Risk of Invisible Airflow Imbalance in an Efficient Contained Data Center
Husam Alissa, Kourosh Nemati, Dr. Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Dr. Demetriou New Solutions, New Challenges Generally, a legacy data center consists of an array of hot and cold aisles where the air intake to the IT equipment resides in the cold aisle and the air exhaust of the equipment rejects hot air into the hot aisle. In a raised floor environment, chilled … [Read more...]
Research Underway for Heat Conductor Substitutes for Diamond
(July 5, 2016) Thanks to a research grant awarded from the Office of Naval Research for pursuing “high risk-high reward” scientific and technological breakthroughs, six universities are working to develop cost-effective and high-quality substitutes for diamond as a heat conductor. Diamond was recently discovered to be the best available heat conductor, however it is too rare … [Read more...]
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