A team of engineers from the University of Utah have discovered a new 2D semiconducting material that could outperform silicon, making electronics cooler and more efficient. “The semiconductor, made of the elements tin and oxygen, or tin monoxide (SnO), is a layer of 2D material only one atom thick, allowing electrical charges to move through it much faster than conventional … [Read more...]
More Energy Efficient Future Supercomputers Thanks to ATP Chemical Found in Humans
Recently, scientists from McGill University have discovered that ATP, “a chemical which provides energy to cells inside the human body, could also power an energy efficient biological supercomputer,” according to Valuewalk.com. Valuewalk said the researchers replaced electrons with Adenosine triphosphate (ATP) “when building chips, in order to reduce costs and cool the … [Read more...]
Pause On Boiling May Lead to Next-Gen Tech for Thermal Management
A Professor at Syracuse University, Shalabh Maroo, his research group, and collaborators at NIST and RPI have “created a single vapor bubble in a pool of liquid that can remain stable on a surface for hours, instead of milliseconds," reported Nanowerk.com. The group used a focused laser beam to put boiling on pause, which will give researchers “the time necessary to … [Read more...]
Higher Temperature Rated MLC Capacitors Announced
Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC, NP0, Ceramic dielectric, with Ultra Low ESR; High Q, and Low Noise. Parts can now be operated up to +175°C with TCC of 0 ± 60 ppm/ºC (limited to +125°C at 0 ± 30 … [Read more...]
New High-Performance Thermal Interface Thin Film
Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c. The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor and a nearby heatsink, said Fujipoly. The Sarcon® YR‐c delivers a thermal conductivity of 4.0 W/m°K with a thermal … [Read more...]
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