Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive … [Read more...]
New 8.0-Watt Thermal Putty
Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A requires very low compression force at high compression rates making it a great choice for applications that have … [Read more...]
Orion Fans Launches IP69K Rated Fans in AC and DC Versions
IP69K rated fans lower the total cost of ownership by reducing maintenance requirements and equipment downtime... DALLAS, TX (February 09, 2021) - Orion Fans has expanded its IP69K rated fans to include both AC and DC versions. Designed for applications that must withstand high temperature and high pressure washdown with water and cleaning chemicals, the IP69K rating offers … [Read more...]
Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a two component, fast setting epoxy with a color coding system where Part A is white and Part B is black. The two parts combine into a uniform gray color paste, which indicates proper mixing. This fast curing, non-drip compound is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume. This high … [Read more...]
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