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SANYO DENKI 40 × 40 × 28 mm High Static Pressure Fan Achieves the Highest Static Pressure in the Industry

 

SANYO DENKI has developed and launched the San Ace 40 9HVA type 40 × 40 × 28 mm High Static Pressure Fan that features the highest static pressure in the industry.(1) This fan is suitable for cooling 1U servers, switching power supplies, and communications equipment. It also comes with the PWM control function to control the fan speed. Features 1. High Static Pressure … [Read more...]

Keeping Cool as the Electric Vehicle Market Heats Up

 

Some of the biggest hurdles to widespread adoption of electric vehicles are range anxiety, battery longevity, and safety. As the electric vehicle market grows and for it to reach its full potential, there is an increased need for effective thermal management of the vehicles. Keeping heat under control leads to improved charging, performance, range, longevity, and safety. The … [Read more...]

What Does the Future of Wireless Charging Technology Look Like?

 

By: Hrishikesh Kadam, Research Content Developer at Global Market Insights (GMI) The world is rapidly going wireless. Within a span of a few decades, phones and internet became wireless, and now charging has become wireless. Even though wireless charging is still pretty much in its early stages, the technology is anticipated to evolve dramatically over the next few … [Read more...]

Power-Rail Dissipation: Diverse Appearances, Unforeseen Consequences

 

One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger cable. As currents increase to tens of amps and much higher, the IR-drop problem become more acute. Even a modest 50 mΩ of … [Read more...]

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation

 

Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]

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