One of the first practical lessons that electronic-circuit designer learn is to be aware of power-rail voltage drop, commonly called “IR drop,” which is the simple product of current and resistance in the printed-circuit board (PCB) track, wire, or larger cable. As currents increase to tens of amps and much higher, the IR-drop problem become more acute. Even a modest 50 mΩ of … [Read more...]
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
ASHRAE Technical Committee 9.9: Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment
Nomenclature A1, A2, A3, A4 ASHRAE allowable thermal envelopes as defined in Thermal Guidelines for Data Processing Environments that represent where IT manufacturers test equipment to ensure functionality ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers CAGR Compound Annual Growth Rate CITE ASHRAE Compliance for IT … [Read more...]
Are Power Electronic Modules a New Growth Opportunity for Conductive Pastes?
Power electronics is a growing market thanks to the electrification of many industries such as the automotive industry. The power electronic modules being used are growing in performance; in particular, they are becoming smaller, lighter weight, more tightly integrated, and better able to handle higher power levels. In some cases the semiconductor technology is also shifting … [Read more...]
Air Ionization Techniques for the Cooling of Electronic Devices: Analysis of the Different Effects of Design Features on Cooling Performance
Rotary fans have been used to cool electronic devices using forced convection applications to achieve the required heat transfer dissipation. In recent years, there has been an increasing trend to miniaturize the size and maximize the efficiency of the electronic devices which, in turn, increases heat generation. The use of rotary fan cooling conflicts with these new trends due … [Read more...]
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