Power electronics is a growing market thanks to the electrification of many industries such as the automotive industry. The power electronic modules being used are growing in performance; in particular, they are becoming smaller, lighter weight, more tightly integrated, and better able to handle higher power levels. In some cases the semiconductor technology is also shifting … [Read more...]
Air Ionization Techniques for the Cooling of Electronic Devices: Analysis of the Different Effects of Design Features on Cooling Performance
Rotary fans have been used to cool electronic devices using forced convection applications to achieve the required heat transfer dissipation. In recent years, there has been an increasing trend to miniaturize the size and maximize the efficiency of the electronic devices which, in turn, increases heat generation. The use of rotary fan cooling conflicts with these new trends due … [Read more...]
Managing Cooling Fan Noise In Product Design
ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
Some New Cooling Ideas are Needed Here
In the 1920s, the field of physics was in disarray. The reason was that many careful observations and experimental data could only be explained by conflicting theories; for example, some proved that light was a wave, while others provided it had a particle-like nature. Other experiments, such as those in black-body radiation or the photoelectric effect, could not be explained … [Read more...]
Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the thermal limitations of power modules. One approach is using semiconductor materials which are able to bypass Si’s … [Read more...]
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