(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the battery pack with the intention of helping Pokemon Go players play for longer amounts of time. The case fits a Samsung Galaxy S4 and “hides a 2,600 mAh battery pack” … [Read more...]
New Raytheon Power Module is Industry Breakthrough
(July 14, 2016) Recently Raytheon has developed a “SiC-based high-temperature small-form-factor power module for electrical switching in harsh environments,” according to Semiconductor-Today.com. Semiconductor-Today reported that, “A prototype module that includes two 1200V silicon carbide (SiC) bipolar junction transistors (BJTs) has currently amassed more than 1000 hours of … [Read more...]
Cooling Powerful Electronics with Powerful Sand
(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer for cooling power-hungry electronic devices,” reported Hexus.net. According to Hexus, “the cooling occurs as the result of a … [Read more...]
Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design
Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According to the company, "The Parker pumps are compatible with a variety of dielectric fluids including PAO, Fuel, Galden, and turbine engine oils. … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
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