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New USB Type-C Connectors and Cable Assemblies

 

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data, consumer, automotive, and industrial I/O applications,” according to Heilind. Heilind also said it’s “Type-C receptacles have a tongued … [Read more...]

Software Update Leads to Device Failure by Overheating

 

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday tasks, and the update was supposed to improve its cooling process, but when users downloaded it and restarted their devices, they “failed … [Read more...]

New Approach to Simulate Nanoscale Thermoelectric Materials

 

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials, according to Phys.org. More specifically, the research group is “investigating the limits of heat transport using a suite of new tools for nanoscale … [Read more...]

New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

 

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. "The US Army's implementation of [this technology for] more electric ground vehicles, facilitates significant improvements in size, weight and power for high temperature … [Read more...]

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