Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more rugged than conventional materials used in electronics, the new circuits are expected to improve the operation of analog … [Read more...]
Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs
Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity and dielectric properties. It is non-corrosive and exceeds ML-C-47113 for thermal conductivity, … [Read more...]
New Plastic Helps Prevent Phones from Overheating
A new plastic material could significantly reduce problems associated with overheating mobile phones, say researchers from Loughborough University in England. Known as ultra-high molecular-weight polyethylene (UHMWPE), the new plastic, unlike the ones currently used in mobile phone covers, dissipates the heat created by the lithium batteries and reduces the likelihood of … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Liquid Cold Plate Cools Power Electronics
Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling and heating performance with no pressure drop. The technology, first developed by Professor PS Lee at the National University of … [Read more...]
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