A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared to traditional air cooling methods, liquid cooling is commonly used in a number of applications such as internal combustion engines in vehicles and … [Read more...]
New Manufacturing Method for High Ratio Air-Cooled Extruded Aluminum Heat Sinks
A new method for manufacturing high ratio air-cooled extruded aluminum heat sinks has been announced by Sapa Extrusions North America. Created by Sapa’s North American Technical Center (NATC), an internal research, design and development center, the new method combines the company’s aluminum extrusion manufacturing techniques with friction stir welding technology to create … [Read more...]
Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications
A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense, data center and power generation thermal management systems. “The problem we are addressing is how to extend NASA space missions,” Krishna Kota, … [Read more...]
Researchers Identify Key Attribute in Surface Dissipation of Heat
New research from MIT that identifies the key attribute in surface dissipation of heat could lead to improved power plant efficiency and better cooling of high-power electronics. A team of MIT researchers has reportedly completed what they claim is the first systematic investigation of the factors that control boiling heat transfer from a surface to a liquid, a process that is … [Read more...]
Liquid Silicone Adhesive Offers High Thermal Conductivity for Bonding Electronic Components
The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications. With a high thermal conductivity of 3.5 W/m-K, Liqui-Bond SA 3505 offers a thermal conductivity previously unavailable in a structural adhesive, the company said. … [Read more...]
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