Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Teledyne to Acquire FLIR Systems
THOUSAND OAKS, Calif. and ARLINGTON, Va. – January 4, 2021 – Teledyne Technologies Incorporated (NYSE:TDY) (“Teledyne”) and FLIR Systems, Inc. (NASDAQ:FLIR) (“FLIR”) jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion. Under the terms of … [Read more...]
KYOCERA Introduces New Thermoelectric Module for High-Performance Heating, Cooling Applications
KYOCERA Introduces New Thermoelectric Module for High-Performance Heating, Cooling Applications Supports extreme thermal-management requirements for COVID-19 investigation, PCR testing, high-performance batteries, and more. San Diego – July 21, 2020 – Kyocera International, Inc. today introduced a compact, highly reliable thermoelectric cooling module specifically … [Read more...]
Normal Distribution
Introduction The previous column in this series [1] discussed statistical probability and showed that the plot of the probability of a given value occurring within a population can look like a hill in which there is a peak in the middle that tapers off to increasingly smaller slopes on each side. The example in that column referred to the scores produced by shaking a number of … [Read more...]
Heilind Electronics and Laird Performance Materials Sign Global Distribution Agreement
Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International. Laird serves leading names in electronics with innovative thermal interface materials; electromagnetic interference shielding materials and magnetic … [Read more...]
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