Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material performance datasheets. The whitepapers cover topics such as the Compression … [Read more...]
Tough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]
Larger Errors with Smaller Stuff
Thermal Facts and Fairytales by Ross Wilcoxon Long time readers of Electronics Cooling will undoubtedly recall one of our former editors: Clemens Lasance. One of Clemens’ many contributions to the magazine was the creation of the original “Thermal Facts and Fairy Tales” column, which provided a forum for him to discuss a variety of issues related to the use and misuse of … [Read more...]
JEDEC Thermal Standards: Developing a Common Understanding
JEDEC Thermal Standards: Developing a Common Understanding The Joint Electron Device Engineering Council (JEDEC) was established to provide recognized technical standards for a wide range of applications, from how to handle electronic packages and defining package outline drawings, to the methods used to characterize performance, including thermal. The JC-15 committee … [Read more...]
Summary of the IEEE ITherm 2019 Conference
Technical Brief John F. Maddox, Ph.D., P.E. The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Cosmopolitan Hotel and Casino in Las Vegas, NV from May 28-31, 2019. This was the 31st Anniversary of ITherm, first held in 1988. The conference was historically held every other year until 2016 when it … [Read more...]
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