Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
Does a 10°C Increase in Temperature Really Reduce the Life of Electronics by Half?
This may seem like a silly question to ask in a magazine entitled “Electronics Cooling”, but why do we really care what temperature of electronics really is, anyway? The simple answer to that question is that it is universally recognized that electronics reliability when devices are too hot for too long of a time. The difficult answers to the question are in defining exactly … [Read more...]
Someday Humans Will “See” The Heat!
Many biological creatures are enabled with the ability to “see” the heat – reptiles, for example, effectively use this ability to detect the size of the heat-emitting object and its range. Other biological entities, including mammals, are enabled with the ability to perceive heat by a process known as Thermoception or Thermoreception. As humans, we are capable of sensing … [Read more...]
Computational Modeling of a Novel End-of-Aisle Close-Coupled Cooling Solution
Data centers are mostly managed by overly conservative thermal management approaches [1]. The typical thermal solution for data centers is perimeter computer room air handlers (CRAH). The traditional cooling method includes supplying air through raised floor plenum that is blown by the CRAH blowers, and the chassis fans, typically located at the rear end of the IT equipment, … [Read more...]
The Problem with Effective Thermal Conductivity
Simply stated, the problem with the use of volume weighted, effective thermal conductivity, kvw, in the thermal modeling of a printed circuit board (PCB), is inaccuracy. In this paper, we show how using kvw can lead to serious errors in the prediction of PCB temperatures. We recommend two, related, alternative procedures that provide greater … [Read more...]
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