(July 15, 2016) According to CBROnline.com, the “Institute of Railway Research has chosen a liquid cooled high-performance computer to run railway safety big data risk analysis.” “The HPC called PetaGen 1C, immerses Intel server electronics in a non-flammable liquid coolant in order to provide dedicated computing sources for the IRR’s big data risk analysis research programme … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements
Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the implications of subjecting thermal requirements on suppliers or coworkers. A rush to get a quick answer or to use the latest feature in an analysis software code … [Read more...]
Research Underway for Heat Conductor Substitutes for Diamond
(July 5, 2016) Thanks to a research grant awarded from the Office of Naval Research for pursuing “high risk-high reward” scientific and technological breakthroughs, six universities are working to develop cost-effective and high-quality substitutes for diamond as a heat conductor. Diamond was recently discovered to be the best available heat conductor, however it is too rare … [Read more...]
Thermal Expansion Discovery Could Lead to More Durable Electronics
(June 27, 2016) Standford professor of materials science and engineering, Reinhold Dauskardt, and doctoral candidate Joseph Burg, recently released a study revealing that the layers protecting transistors in chips respond differently to compression and tension of bending and stretching. “It has always been assumed that these dense insulating materials react exactly the same … [Read more...]
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