(July 18, 2016) The complimenting research done by Oak Ridge National Laboratory and the University of Tennessee Knoxville has found a way to improve the heat dissipation in electronics using 3D printing. According to 3DPrint.com, “[Oak Ridge] researchers are showing that 3D printed aluminum may be a more viable source for conducting heat than traditional materials. And at … [Read more...]
New Material Allows Quantum Computing without Overheating
(July 21, 2016) Recently, with the use of some everyday materials, researchers discovered a breakthrough that would allow quantum computing at room temperature. “A long conduction electron spin lifetime in metallic-like material made up of carbon nanospheres […] was produced simply by burning naphthalene, the active ingredient in mothballs,” reported TheConversation.com. “The … [Read more...]
Liquid Cooled Computer Runs Train Safety Big Data Analysis
(July 15, 2016) According to CBROnline.com, the “Institute of Railway Research has chosen a liquid cooled high-performance computer to run railway safety big data risk analysis.” “The HPC called PetaGen 1C, immerses Intel server electronics in a non-flammable liquid coolant in order to provide dedicated computing sources for the IRR’s big data risk analysis research programme … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements
Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the implications of subjecting thermal requirements on suppliers or coworkers. A rush to get a quick answer or to use the latest feature in an analysis software code … [Read more...]
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