New research from MIT that identifies the key attribute in surface dissipation of heat could lead to improved power plant efficiency and better cooling of high-power electronics. A team of MIT researchers has reportedly completed what they claim is the first systematic investigation of the factors that control boiling heat transfer from a surface to a liquid, a process that is … [Read more...]
Discovery Could Change Textbook Models on Heat Transfer
A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s Center for Condensed Matter reportedly found ballistic thermal conduction by phonons at room temperature along silicon-germanium nanowires. While … [Read more...]
Tiny Thermometer Measures Atomic-Scale Heat Dissipation
A breakthrough demonstration of heat dissipation at the atomic scale by an international research team could help scientists overcome major technological hurdles in the development of smaller, more powerful electronics. Heat—produced when a current passes through a conductive material—remains a major obstacle in the continuing development of smaller, faster, more reliable … [Read more...]
“Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
Northwestern University researchers are investigating the possibility of vertical heat transport for better cooling devices. A new paper published in Physical Review Letters by researchers at Northwestern University in Illinois explores the idea of using materials in which heat flows perpendicular to an electric current to develop better devices for cooling … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
