Introduction Vapor chambers are passive two-phase devices used to spread heat from localized hotspots to larger surface areas. The device utilizes the latent heat of evaporation of an internal fluid to passively transport heat from the evaporator (heat source) to the condenser (heat sink) across very low-temperature drops. Condensed liquid returns to the evaporator from the … [Read more...]
Generative Design and Advanced 3D Printing: A Copper CPU Cooler with 55% Lower Thermal Resistance
Introduction Effective cooling is essential for CPUs, as they generate significant heat during operation while being very temperature sensitive. Improved cooling allows for maintaining the functionality of high-performance computer hardware. In this article, we demonstrate a unique approach to improving the cooling of high-performance components by combining thermal and … [Read more...]
Network Implementation of Advective Thermal Conductances
Overview Accurate modeling of thermal networks requires that all relevant modes of heat transfer, including advection, be included. Otherwise, component temperatures may be under- or over-estimated. This article presents a method for systematically including advection in one-dimensional (1D) thermal networks, via the use of unidirectional elements in the thermal network … [Read more...]
Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center
Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for its Manila, Philippines, colocation data center. Using the patented StatePoint technology - an industry-leading sustainable cooling solution for … [Read more...]
Mechanical Cycling Reliability Testing of TIMs Developed Specifically for Semiconductor Test
KEYWORDS Thermal Resistance | Thermal Interface | Semiconductor Test | Durability | Cycling | Device Under Test NOMENCLATURE DUT Device Under Test OSAT Out-Sourced Assembly and Test Rth Thermal Resistance S/TB Semiconductor Test and Burn-In TIM Thermal Interface Material ABSTRACT Many thousands of thermal interface materials (TIMs) exist due to the very wide … [Read more...]
- « Previous Page
- 1
- …
- 3
- 4
- 5
- 6
- 7
- …
- 45
- Next Page »
