EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has announced the availability of an advanced circuitry engineering option for the company’s thermoelectric cooling units that enables “maximum cooling output regardless of available power supplies or the integrity of the voltage flow.” The new advanced circuitry … [Read more...]
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird currently have a strategic design and distribution partnership, the acquisition will … [Read more...]
Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles
Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The new method may have the potential to widen the use of thermoelectric devices. In cooperation with graduate student … [Read more...]
3200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to the 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes … [Read more...]
Research Program Attempts Embedded Cooling
DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and packages. … [Read more...]
- « Previous Page
- 1
- …
- 29
- 30
- 31
- 32
- 33
- …
- 40
- Next Page »
