Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that thermal management remained a challenging field. Fortunately, developments and improvements in thermal management hardware have assisted the electronics packaging community by enabling higher … [Read more...]
Latest Developments In Thermoelectrically Enhanced Heat Sinks
Nomenclature Q Heat load (W) COP Coefficient of Performance I Electrical current (Amps) T Temperature (°C) R Electrical resistance (Ohms) Z TE Figure of Merit (1/K) where Z = α2 / (ρ λ) Greek Letters Δ Change in value θ Thermal resistance (°C/W) ρ Electrical resistivity (Ohm-cm) α Seebeck coefficient (V/K) λ Thermal conductivity … [Read more...]
Communication Network Power Efficiency Assessment, Limitations and Directions
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by approximately 80% yearly in each of the last three years, and will continue to grow at 60 - 80% annually … [Read more...]
Opto-electronic Transceiver Modules, a System Design Perspective
Introduction Small Form Factor (SFF) optical transceiver packages for use at 1-2 Gbits/s data rates have been described by several authors [1-5]. These rely on dual miniature optical connectors such as the MT-RJ or the LC to provide optical-component case widths as small as one centimeter. Passive alignment of the optical fibers with the active optical devices is achieved with … [Read more...]
Cooling Technology Options
(Editor's Note: Part 2 of this article will appear in the November 2003 issue of ElectronicsCooling.) Cooling electronic systems is one of the major focal points of the design process and the key to a successful product launch. Many options to attain successful operation are available, ranging from passive cooling to cryogenics. These options are obviously power dissipation … [Read more...]
