Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
Some New Cooling Ideas are Needed Here
In the 1920s, the field of physics was in disarray. The reason was that many careful observations and experimental data could only be explained by conflicting theories; for example, some proved that light was a wave, while others provided it had a particle-like nature. Other experiments, such as those in black-body radiation or the photoelectric effect, could not be explained … [Read more...]
Thermal Management of Electronic Equipment using Phase Change Materials (PCMs)
Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy … [Read more...]
Thermally Conductive, Flame Retardant Epoxy Adhesive for Avionics
Master Bond’s EP93AOFR is a two-part thermally conductive epoxy adhesive that offers superior heat dissipation for a wide range of electronic applications. It can be used in encapsulation and potting applications, as well as in bonding, sealing, and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only … [Read more...]
Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the thermal limitations of power modules. One approach is using semiconductor materials which are able to bypass Si’s … [Read more...]
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