Hackensack NJ November 2018. - Apart from their traditional use as fastening materials, adhesives also find wide application in bonding and encapsulation in segments as diverse as military/aerospace, medical, automotive, and industrial. Adhesive systems can differ in temperature resistance, thermal cycling resistance, viscosity, flexibility, cure times and other … [Read more...]
Creative Materials Introduces Two-Component Electrically Conductive Epoxy Adhesive
Ayer, MA, September 2018 –Creative Materials introduces GPC-251/CA-414, a room temperature curing,two-component electrically conductive epoxy adhesive for making electrical and mechanical attachments on electrical components and devices. This new product, unlike others of its kind, has excellent electrical and mechanical properties and is less sensitive to handling under … [Read more...]
New Product Launch: April 17, 2018 – Thermally Conductive Dispensable PCM Interface Paste, 3.5W/m.K
New from European Thermodynamics - the latest addition to the thermal interface material range from brand Global Component Sourcing (GCS), the phase change material GCS-TRP35-PCM. Ideally suited to fill spaces of up to 0.15mm, the GCS-TRP35-PCM phase change thermal interface material is used to fill air gaps/voids between two surfaces. This provides full thermal contact in … [Read more...]
Pre-cured, Single-component Silicone Solution Minimizes the Mix
SHIN-ETSU SILICONES LAUNCHES CLG SERIES GAP FILLERS WITH IMPROVED RESISTANCE AGAINST PUMP-OUT FOR ADVANCED THERMAL MANAGEMENT ELECTRONICS APPLICATIONS. Akron, OH | February 2018 - In an effort to provide progressive options to thermal engineers in the growing electronics cooling market sector for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, … [Read more...]
New Synthetic Dielectric Coolants Deviate From Traditional Petroleum-based Dielectric Oils
Image Caption: A capacitor failure on a GPU board was caused from oil absorption through the capacitor’s rubber seats while emerged in white oil. As higher clock frequencies and smaller transistor dimensions continue to increase the power density of high-performance computing technologies, such as CPUs, GPUs, FPGAs, Laser Diodes, and Optical electronics, advances in thermal … [Read more...]
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