Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
Does a 10°C Increase in Temperature Really Reduce the Life of Electronics by Half?
This may seem like a silly question to ask in a magazine entitled “Electronics Cooling”, but why do we really care what temperature of electronics really is, anyway? The simple answer to that question is that it is universally recognized that electronics reliability when devices are too hot for too long of a time. The difficult answers to the question are in defining exactly … [Read more...]
New Line of Dielectric Coolants Launched
Engineered Fluids announces the commercial release of its CoolFluids line of high performance dielectric cooling fluids. Designed specifically for single phase, direct immersion cooling of electrical devices, CoolFluids are biodegradable, non-toxic, synthetic dielectric coolants with more than 1800x the cooling capacity of air. In addition, CoolFluids have an extremely … [Read more...]
New Adhesive Transfer Tapes Introduced
Polyonics introduces a new family of adhesive transfer tapes at the International Converting Exhibition in Orlando 25-27 April. The tapes are designed specifically for high temperature bonding of electronic, transportation and general industrial components. The solvent-based, double linered adhesives are available in acrylic and ultra-high temperature silicone. They provide … [Read more...]
A Brief Overview of Thermal Management in Printed Electronics
Editor’s Note: This is the first in a series of articles to appear in Electronics Cooling addressing emerging areas for electronics thermal management. Printed electronics (PE) is one of the key enabling technologies of many electronic products that we take for granted today, not just in functional feasibility but also in cost that seems to be on a continuous downward trend. … [Read more...]
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